Dangelmayer Associates LLC, Trusted ESD Programs Since 1978 LogoDangelmayer Associates LLC, Trusted ESD Programs Since 1978Dangelmayer Associates Logo

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“You do not need to do this: survival is not mandatory”–Dr. W. Edwards Deming

Our Services » ESD » Training » Customized ESD Training

Training | Experience | Workshops | Computer-Based | Customized | Testimonials

Customized ESD Training Courses

Dangelmayer Associates is a globally recognized for outstanding training skills and customized courses such as CDM, CBE, EOS, S20.20, Class 0, ESD Program Management. Student comments and testimonials are invariably highly complimentary. For instance, at the international EOS/ESD Symposium we were the only ones to receive a perfect score (5.0) by students in all categories. We offer instructor led or CBT (Computer Based Training) training from the basics to highly advanced research and development. Our technical accuracy is unparallel due to 10 advanced engineering degrees. We have managed training programs for Global S20.20 programs as ESD program Managers for AT&T, HP, Motorola, and Finisar.

Student Testimonials:

“My expectations were surpassed in all respects”

“Outstanding Presentation Skills!”

“The Instructors are obviously experts and very professional!”

“Very good interaction, relaxed environment and non-intimidating!”

Customized ESD Courses:

  1. ESD Basics
  2. ESD Basics with CDM and Class 0
  3. S20.20 Implementation & Management
    1. Tailoring for CDM & Class 0
  4. Compliance Verification Sampling Plans & Techniques
  5. Basic ESD Auditing Measurements
  6. Advanced Auditing Techniques
  7. Pitfalls of ESD Auditing Equipment
  8. Today’s Manufacturing Challenges
    1. Trends, Class 0, CDM, Charged Board Event
    2. “The Perfect ESD Storm”
  9. Workshops:
    1. Advanced ESD Program Management
    2. CDM & Class 0
    3. Hands-On Auditing Measurements
    4. Customized Agenda
  10. Product Designed-in Protection Seminar
  11. Charged Board Event
  12. Training for Operators
  13. Twelve Critical Factors of ESD Program management
  14. CDM & Class 0 Control Techniques
  15. Common Myths
  16. Economic and Strategic Benefits
  17. Common Problems in Manufacturing
  18. Material Characterization, Packaging Considerations and Purchasing Guidelines
  19. Training Techniques and Demonstrations
  20. Impracticable Customer Requirements
  21. Analysis and Qualification of Automation Equipment


Course Descriptions:


  1. ESD Basics
  2. This tutorial provides the foundation material for understanding electrostatics and ESD and their role in the manufacture and handling of ESD sensitive devices.  The fundamental properties of charge, electric fields, voltage, capacitance and current are discussed with a view towards understanding key electrostatic phenomena and electrical processes.  These include charge generation and decay, material properties and induction.  An overview of device failure mechanisms is presented, including how these models impact ESD control programs.  Finally, the course provides an overview of ESD control procedures during handling and manufacture and an overview of ESD S20.20 program requirements.  This full day course is required for those in-plant auditors and program managers who are working toward professional ESD certification.  The presentation includes many in-class demonstrations, videos and animated slides. 


    Some sample topics covered in this course are:

    • Definitions and relationships among important electrical and mechanical properties
    • Causes of charge generation and decay.
    • Field effects and voltages
    • Role of capacitance in ESD (Q=CV)
    • Overview of key measurements including common pitfalls of some measurements
    • Review of ESD failure models
    • Understanding and demonstrating electrostatic induction
    • Utility and limitations of air ionization
    • Basic goals of ESD controls
    • Properties of effective ESD control products and materials

    Overview of ANSI/ESD S20.20 ESD program development requirements


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  3. ESD Basics with CDM and Class 0
  4. Same as Course #1 with CDM and Class 0 concepts and control techniques added.


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  5. S20.20 Implementation & Management
    • Tailoring for CDM & Class 0

    During this highly interactive tutorial you will learn how to organize, implement and manage an S20.20 ESD program with a total system approach that extends from design to customer acceptance.  Please note the scope of S20.20 (www.esda.org) is limited to HBM (Human Body Model) sensitivities above 100 volts.  So, this course will also show you how to tailor S20.20 to include current best practices such as CDM (Charged Device Model), CBE (Charged Board Event), and Class 0 devices.  


    You will learn that managing the details of a program is essential and how many companies fail to recognize the importance of sound program management.  S20.20 Administrative and Technical requirements will be explained in understandable terms that will lead to S20.20 certification.    A number of common program management myths will be dispelled with the discussion of a few compelling case studies.  The changes and enhancements in S20.20 – 2007 will be detailed along with a comparison to the 1999 issue.


    Eye opening training demonstrations will be shown to help dispel common myths as well as to explain a number of common problem areas.  You will actually see ESD events as they occur!  Students will actively participate in the discussion of photographs depicting common problems complying with S20.20.  Come and view work positions through the eyes of an auditor and learn how pass S20.20 certification the first time.



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  6. Compliance Verification Sampling Plans & Techniques
  7. Compliance Verification is the binding force behind sound ESD program management and this session covers strategies, methods and frequencies.   The success or failure of an ESD program is highly dependent on how the auditing data is reported and used to manage the program.  Auditing is one of the most critical elements of program management. The data derived from sound auditing plans can be highly effective in the early identification and prioritization of process excursions.  This data can also be used to effectively leverage limited resources and time.    


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  8. Basic ESD Auditing Measurements
  9. This highly interactive session explains how to correctly use ESD test equipment such as static locators, wide range meg ohm meters, charge plate analyzers,  surface resistance and resistivity meters,  hygrometers, and EMI/ESD event detectors.   There are a number of common pitfalls that can result in false readings from these instruments.  Students will learn how to avoid these pitfalls as well as which meter to use for which application and why.   Each student will perform the tests themselves with expert guidance.   The hands on classroom work will be followed by student application of the auditing measurements on the manufacturing floor when the course is delivered at a manufacturing location.


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  10. Advanced Auditing Techniques
  11. Conventional auditing techniques are in sufficient for Class 0 devices and assemblies.   Advanced techniques such as ESD event detection have become an essential requirement for problem identification, equipment qualification and ongoing management of the program.   Event detectors do not replace voltage or resistance measurements but when used in concert are far more effective.   Detectors, however, are more complicated to use and require a full understanding of the technology.   You will learn how to use a variety of detectors and how to ignore back ground noise that can interfere with ESD event detection.  


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  12. Pitfalls of ESD Auditing Equipment
  13. Come join us for this highly interactive workshop on the proper use of ESD test equipment.  Pitfalls of common instruments will be explained as well as the invalid test results that can result.  For instance, static locators can yield totally invalid readings when used incorrectly due to voltage suppression.   Demonstrations will be chosen by attendees from an equipment list such as static locators, ionizers, EMI/ESD Event Detectors, Resistance meters, various resistance probes (S11.11 & NFPA) etc.  Find out if static locators can be used accurately to test automation equipment, conveyor belts, document carriers with paper inside, ionizers or rapidly moving operations?   



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  14. Today’s Manufacturing Challenges
    • Trends, Class 0, CDM, Charged Board Event
    • “The Perfect ESD Storm”

    This highly interactive course describes today’ manufacturing challenges including “The Perfect ESD Storm” that is brewing in the electronics industry as well as the counter measures each company must take!  CDM & Class 0 are Converging to Create a Violent ESD Storm and most companies are ill prepared!  This is a result of the trend towards ultra-sensitive components (Class 0) and the wide spread lack of adequate CDM (Charged Device Model) understanding.   The following questions will be answered with data and case studies.  Is the Class 0 trend really happening this time?  Is it likely to be a problem in your factory?  How big a problem is CDM in manufacturing?  What is different about CDM control procedures?   How do I tailor S20.20 for CDM and Class 0?


    The CDM pulse is typically one nano second in duration with rise times in pico seconds.  This contrasts sharply with the 160 nano second HBM pulse.  As a result, manufacturing counter measures are substantially different and have only begun to come to light in recent years due to the growing percentage of CDM failures in the factory and field.   Today approximately 95% of ESD failures are CDM and the control techniques are far from common knowledge.  For instance, the ESD Association Standard S20.20 may be the best manufacturing control procedure available and, yet, the scope of the standard covers HBM procedures for device sensitivities above 100 volts.  CDM and Class 0 procedures are not covered in the scope of the standard.   This example is one of many that illustrate why most companies are ill prepared for CDM and Class 0 devices – “The Perfect ESD Storm”.


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  15. Customized Workshops:
    • Advanced ESD Program Management
    • CDM & Class 0
    • Hands-On Auditing Measurements

    These highly interactive workshops provide cost effective solutions for implementing technically sound ESD programs with emphasis on the customers areas of greatest need.     The Workshops are most effective when limited to 10 students and conducted at a customer manufacturing site so that hands on assessments and demonstrations can be made on the manufacturing floor.  A portion of the workshop will include a mini Technical Assessment (without a written report).  The results and corrective actions required for sound ESD program management and S20.20 will be discussed in the classroom.  Curriculum content will be tailored to customer needs.  When finished, students will have a fundamental understanding of how to implement a sound program and test the various elements of the program.     Often this workshop is followed by our coaching services to assist with and facilitate swift and technically sound implementation of such programs.


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  16. Product Designed-in Protection Seminar
  17. This course sprovide an overview of the ESD effects on electronic assemblies and the techniques used to prevent ESD damage.  Emphasis will be given to Class 0 devices and high frequency applications.  The material will also include descriptions of ESD failure mechanisms, failure mode analysis examples and photographs and industry trend information.




    1. Introduction/Scope
    2. ESD Effects on Electronic Equipment
      1. ESD Threats
        • Handling
        • Automation
        • Installation/Transport
      1. Device Level Models (HBM, CDM, other)
      2. Latency
      3. EOS/ESD Differences
      4. Charged-Board
      5. Charged-Cable
      6. System
    1. ESD Protection Evaluation
      1. Test methods
      2. Specifications
      3. Classification
    2. Technology Trends and Protection Trade-Offs
    3. Design Protection Principles (Including Class 0 Considerations)
      1. Device level Overview
      2. Board & Assembly
        • Overall Strategy
        • Grounding/Equipotential Bonding
        • Layout
        • Component Selection
        • Surge Protection Devices
        • Shielding
        • Physical Design
          • Connectors
          • Housings
      1. System Level Overview
    1. Manufacturing Current Best Practices (Including Class 0)
    2. Open Discussion and Conclusions



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  18. Charged Board Event
  19. It has long been known that ICs and other ESD-sensitive components remain at risk when they are mounted onto printed-circuit boards and other assemblies.  However, most ESD testing and characterization of these components has been done on stand-alone parts.  Further, IC failure analysis data, which is based on knowledge of failure signatures seen in standard HBM and CDM tests, has caused many to conclude that ESD failures are relatively rare when compared to other electrical failures commonly classified as electrical overstress (EOS).  Recent data and experience reported by several companies and laboratories now suggest that many failures previously classified as EOS may instead be the result of ESD failures due to Charged Board Events (CBE).   A Charged Board stores much more energy than a device (IC) because its capacitance is many times larger.  In fact, the charge (energy) transferred in the event is so large that it can cause EOS-like failures to the components on the board.  In this seminar, this board-level ESD event will be compared with the component level CDM ESD event.   The waveforms from both ESD events will be compared and it will be shown that for the same voltage, the current in the board-level ESD event will be much higher than that from the chip-level ESD event.  A summary of literature and industry data will be given.  It is suggested that failure analysts give stronger consideration to these types of Board events before  assigning an  EOS diagnosis to the failure.  This will support more effective root cause analysis and prevention of these failures. 


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  20. Training for Operators
  21. This highly interactive course will be customized to customer needs including, ESD basics appropriate for operators, photographs of ESD issues taken at the customer site, the does and don’ts of current best practices, videos and engaging demonstrations.

    Eye opening training demonstrations will be shown to help dispel the common myths as well as to explain a number of the common problem areas and fundamentals of ESD.  You will actually see ESD events as they occur!  Students will actively participate in the discussion of photographs depicting common problems encountered during production line audits.  Come and view work positions through the eyes of an auditor and learn how auditing is the binding force behind a sound ESD program!



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  22. Twelve Critical Factors of ESD Program management
  23. This is a discussion that follows and expands on our book, ESD PROGRAM MANAGEMENT by Ted Dangelmayer.  Emphasis will be placed on current best practices and key elements of program management such as how to achieve and sustain management commitment, realistic requirements, internal auditing, and training.


    Developing, implementing, and managing a successful ESD program requires a total system approach that extends from product design to customer acceptance. The program will need to be well managed and woven into every aspect of the manufacturing process in order to produce lasting success. In fact, a well-managed program can be far more effective than one well stocked with expensive supplies. Twelve critical factors form the basis of successful ESD program management.



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  24. CDM & Class 0 Control Techniques
  25. CDM and Class 0 control methods are not adequately covered in any of the industry standards including S20.20 and there is a strong trend toward extensive use of these ultra-sensitive devices. 


    Learn the current best practices for CDM and ultra-sensitive components.  Overcome the wide spread lack of understanding about CDM (Charged Device Model) and prepare for Class 0 at the same time.   Case studies will illustrate how CDM failures can persist even with a robust HBM program in place.   A series of photographs of common CDM issues in manufacturing will enable students to visualize how to implement CDM controls.  A brief summary of the work by the Industry Council on ESD Target Levels will be included.     


    It is no longer business as usual and it can take up to two years to prepare (example – equipment retooling etc.).  Join us for this highly interactive tutorial and learn why these challenges are inevitable and how to prepare for them.


    Get the answers to your questions as well as these examples.  Are you skeptical about this news of a Class 0 trend?  Is it really happening?  Is it likely to be a problem in your factory?  How big a problem is CDM in manufacturing?  What is different about CDM controls?   


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  26. Common Myths
  27. There are a number of common misunderstandings about ESD Program Management that can have significant impact on the implementation and maintenance of the ESD program. Some of these misunderstandings or "myths" result in unnecessary expenditures; others result in a compromise of the program integrity.  These same myths are often cited by skeptics not wanting to adhere to certain standard ESD procedures. As a consequence, it is important to identify and dispel these myths.


    Join us for this highly interactive discussion and learn about common myths such as: 

    Myth: PWB Assemblies Are Not ESD Sensitive

    Myth: One ESD Sensitivity Classification Is Sufficient for All Areas

    Myth: HBM Data Are Sufficient for Detecting Device Sensitivity Levels

    Myth: Air Flow Causes Charging

    Myth: Metalized or Highly Conductive Shielding Layers Are Essential


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  28. Economic and Strategic Benefits
  29. The strategic and economic benefits of this Electrostatic Discharge (ESD) program far outweigh the associated expenses. Measurement of these benefits has been an elusive problem for many companies. Measurable financial indicators alone justify program expenses. However, after considering the strategic benefits, the value of a sound ESD program becomes overwhelming and return on investment is typically 1,000 percent.


    During this tutorial you will learn how to measure and document these savings.  Case studies will illustrate various ways asses your potential savings.   As a rule of thumb, 50% of EOS failures are charged board ESD failures, 33% of NTF’s  (no trouble found) are ESD induced, and ESD failure rates vary depending on device sensitivities and can approach 100% for Class 0 components.



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  30. Common Problems in Manufacturing
  31. The most common ESD problems encountered in manufacturing are shown in photographs during this highly interactive discussion.  These common problems will cover 80% of the issues commonly seen in manufacturing.    Students are asked to identify the problems and then the technical issues are explained.   This session is always very popular with students and highly instructive. 


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  32. Material Characterization, Packaging Considerations and Purchasing Guidelines
  33. Technically sound material selection is vitally important to ESD program management.   Many companies are spending far more than necessary on materials.  For instance, our technical advice enabled one company to reduce their outgoing product packaging costs by $400,000 USD per year.   Others let purchasing go to the lowest bidder without consideration of the “best value” ESD control products.  


    Although packaging and handling materials are intended to provide protection for the contents, it can be the cause of Electrostatic Discharge (ESD) failures unless special materials and/or procedures are used.  The successful implementation of ESD-protective packaging/materials and procedures depend on having a basic understanding of how sensitive devices may be damaged in a package or during the packaging procedure and how the protective procedures work.


    This tutorial presents the basic concepts to consider in selecting Special materials for ESD-protective packaging and handling.. These Concepts apply not only to “traditional” packaging (cartons, bags, and boxes), but also to temporary packaging used during manufacturing (tote boxes) and to other surfaces that may contact a device during manufacture (bench tops, etc.).




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  34. Training Techniques and Demonstrations
  35. Training is clearly one of the most critical elements of an ESD program and some techniques are far more effective than others.  Until now, the invisible nature of ESD has been a substantial training obstacle.  We have developed a revolutionary why to make ESD events visible to students.  Skeptics become advocates once they can see the events and this enables them to understand why ESD procedures are necessary.  The result is better learning and better compliance to procedure.  A variety of highly effective training techniques and demonstrations are presented.



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  36.  Impracticable Customer Requirements
  37. Customers that do not fully understand the ESD technology often place stringent and unrealistic requirements on suppliers.  Customer requirements often differ considerably and this creates significant hardship on board manufacturers.  As we all know, “the customer is always right”!   This session will present proven techniques to overcome these customer issues.  Students are encouraged to bring examples for discussion.


  38. Analysis and Qualification of Automation Equipment

Most companies do not have adequate procedures or understanding of the technology to perform meaningful analysis and qualification of automated manufacturing equipment.   For instance, very few companies include EMI/ESD analysis of this equipment.  The true jeopardy and sources of ESD damage are extremely difficult to locate without EMI/ESD event detection.   The use of event detection equipment appears complicated until it is properly explained and demonstrated.  This session is also highly interactive with numerous photographs and hands-on use of the equipment



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