|
SEMINARS & EVENTS *Events highlighted in light-blue background are supported by Dangelmayer Associates
|
2009 - 2010
|
Date |
Topic |
2010 Webinars and Workshops
June 24, 2010
ESD Webinar: Air Ionization: Uses and Limitations for ESD and Cleanroom Applications
September 9, 2010
ESD Webinar: Automation Advanced Auditing Measurements
November 18, 2010
ESD Webinar: Automation Advanced Qualification Test Methods
July 27, 28 & 29, 2010
ESD Workshop - Class 0, CDM, CBE & Class 0 Certification
|
|
April 14, 2010
Time: 8:30 a.m. - 12:00 p.m.
Instructor: Arnold Steinman, Electronics Workshop
Location: Bloomington, MN
For complete flyer and registration form: download NC Flyer
Cost before 3/17/10
Members-$295, Non-Members-$395
Cost After 3/17/10
Members-$495, Non-Members-$495
This class is part of the ESDA Program Manager Certification curriculum. More details on the Professional Certification Programs offered by ESDA are on our website at www.esda.org/certification.html
|
Ionization and Answers for the Program manager
The primary method of static charge control is direct connection to ground for conductors, static dissipative materials, and personnel. But a complete static control program must also deal with isolated conductors, insulating materials, and moving personnel that cannot be grounded. Air ionization can neutralize the charge on insulated and isolated objects.
This seminar will
· Examine problems caused by static charge
· Review common methods for generation and control of static charge
· Establish the importance of ionizers in a static control program through demonstrations
· Illustrate charge generation and control through demonstrations
· Explain the major types of ionizers and the varying environments in which they are used
· Discuss electrical and performance test methods
· Demonstrate ionization measurements using the Ionization Standard
· Present installation, safety, maintenance, and contamination issues
· Analyze case histories of the use of ionizers in a variety of work environments
|
|
March 25, 2010
on-line presentation
Course length: 1 hour
Time: 10:00 a.m. Eastern Time
Instructor: Ted Dangelmayer
Dangelmayer Associates, L.L.C.
More Info: Go to PDF Flyer
| Cost |
members |
non-members |
| |
$95.00 |
$140.00 |
Please Register by March 11th
For registration information visit: Registration in PDF Format |
Stay Educated! Stay Current! Ultra-Sensitivity Trends and CDM
Online Training
The electronics industry faces a double challenge: increasing use of ultra sensitive devices and lack of experience with the Charge Device Model (CDM). This class will give you the background to understand the challenges and prepare to meet them. Case studies will illustrate how CDM failures can persist even with a robust HBM program in place. A series of photographs of common CDM issues in manufacturing will enable students to visualize how to implement CDM controls. A brief summary of the work by the Industry Council on ESD Target Levels will be included.
It is no longer business as usual and it could take up to two years to prepare (example - equipment retooling etc.). Join us for this highly interactive tutorial and learn why these challenges are inevitable and how to prepare for them.
Get the answers to your questions as well as these examples. Are you skeptical about this news of the trend toward the extensive use of ultrasensitive components? Is it really happening? Is it likely to be a problem in your factory? How big a problem is CDM in manufacturing? What is different about CDM controls?
|
|
March 18, 2010 - 2:00pm to 3:30pm EST
Speakers: Ted Dangelmayer & Carl Newberg, Danglemayer Associates, LLC
Location: The Internet (Webinar)
Developed by: Danglemayer Associates, LLC
Cost:
$235 per Webinar registrant
$295 per Slide Set (for Webinar registrants)
$395 per Slide Set for non-registrants
More Info:
WHO SHOULD ATTEND
This tutorial is intended for professionals who have a basic understanding of ANSI S20.20 but are not fully aware of the strengths and limitations.
THE WEBINAR FORMAT
A live Webinar is one that you can "attend" and participate in right from your office. The savings are significant - no travel time or hassle and no travel expense. It's easy; you only need a telephone or VoIP and access to the Internet.
The audio portion is delivered over the telephone or VoIP for reliable and clear sound quality. At the same time, talk with the experts as you view the speakers' Power Point presentation.
The Webinar is also interactive so you will be able to ask questions of the experts and provide comments during the course of the program. Questions may be submitted prior to the Webinar by e-mail to Kristin@Dangelmayer.com.
|
WEBINAR INFORMATION
Date: March 18, 2010
Time: 2:00 pm to 3:30 pm EST
Dial-in instructions as well as the URL address for accessing the Webinar will be e-mailed to you one week before the program.
WEBINAR FEES
$235 per registrant
Please note: Your registration entitles you to one telephone connection and one computer connection at one physical location. Group discounts are available upon request. Any transmission, retransmission, or republishing of the audio or web portion of this program is strictly prohibited. International registrants may incur additional phone charges.
WEBINAR SLIDES - pdf of presentation slides via email.
$295 for Webinar registrants
$395 for non-registrants
CANCELLATION:
Email requests for cancellation may be made to Kristin@Dangelmayer.com. Registrants will receive a full refund, minus a $50 cancellation fee. No refunds will be provided after March 15, 2010.
FOUR WAYS TO REGISTER:
Phone - 1-978-281-4567 to order with a credit card
E-mail - Complete and email the attached registration form to Kristin@Dangelmayer.com
Fax - Complete and fax the attached registration form to 1-978-282-4884
Mail - Complete and mail attached registration form to:
Dangelmayer Associates, L.L.C.
14 Butternut Lane
Gloucester, MA 01930
All registrations must be prepaid and in U.S. Dollars prior to the Webinar.
|
|
ESD Webinar - ANSI S20.20 Strengths and Limitations
ANSI S20.20 - 2007 is the best ESD standard available for manufacturing handling practices. It is becoming widely recognized within the electronics industry, defense manufacturing and the FDA, and many sites have been certified. This success speaks well of the many strengths of S20.20. As with any standard, however, there is an intended application and scope that limits the applicability. For instance, ESD Class 0 has unique and complex requirements that require significant customization of the requirements of S20.20.
Join us for this highly interactive Webinar and learn not only about the strengths but also how to customize S20.20 to address current technological ESD challenges such as Class 0, CDM and Charged Board Events (CBE).
The Webinar format offers VoIP and phone line connections. You will be able to talk directly with our team of experts and see our cursor pointing to discussion topics and photos in the slides.
|
|
January 27, 2010, 3:00 pm
Speakers: Terry Welsher, Danglemayer Associates, LLC
Location: 3M Innovation Center, 6801 River Place Blvd., Austin, TX 787
Developed by: Danglemayer Associates, LLC
More Info: Go to Central Texas ESD Chapter’s website
|
Charged-Board Events: Part Of An Increasingly Complex ESD Testing Landscape
Abstract
It has long been known that ICs and other ESD-sensitive components remain at risk when they are mounted onto printed-circuit boards and other assemblies. However, most ESD testing and characterization of these components has been done on stand-alone parts. Further, IC failure analysis data, which is based on knowledge of failure signatures seen in standard HBM and CDM tests, has caused many to conclude that ESD failures are relatively rare when compared to other electrical failures commonly classified as electrical overstress (EOS). Recent data and experience reported by several companies and laboratories now suggest that many failures previously classified as EOS may instead be the result of ESD failures due to Charged Board Events (CBE). A charged board stores much more energy than a device (IC) because its capacitance is many times larger. In fact, the charge (energy) transferred in the event is so large that it can cause EOS-like failures to the components on the board. In this seminar, this board-level ESD event will be compared with the component level CDM ESD event. The waveforms from both ESD events will be compared and it will be shown that for the same voltage, the current in the board-level ESD event will be much higher than that from the chip-level ESD event. A summary of literature and industry data will be given. It is suggested that failure analysts give stronger consideration to these types of board-level events before assigning an EOS diagnosis to the failure. This will support more effective root cause analysis and prevention of these failures. CBE is one of several new ESD testing directions that are not adequately covered by the standard HBM and CDM tests. This broader landscape will be reviewed and the status of the different directions will be described and challenges resulting from the technology road maps will be discussed.
|
|
December 8, 2009 (Note Date Change), 1:30 pm to 3:00 pm EST
Speakers:Ted Dangelmayer and Terry Welsher, Danglemayer Associates, LLC
Location: Online
Developed by: Danglemayer Associates, LLC
More Info: Go to PDF Flyer
Fees for Online Webinar:
$235 per registrant
FOUR WAYS TO REGISTER:
Phone - 1-978-283-5156 to order with a credit card
E-mail - Download, Complete and email the registration form to Vicki@dangelmayer.com
Fax - Download, Complete and fax the registration form to 1-978-282-4884
Mail - Download, Complete and mail registration form to:
Dangelmayer Associates, L.L.C.
14 Butternut Lane
Gloucester, MA 01930
All registrations must be prepaid and in U.S. Dollars prior to the Webinar. |
ESD Webinar
Class 000* Measurements and Controls
Join us on December 8, 2009 (note date change) at 1:30 pm
EST for this 90 minute highly interactive Webinar and learn
how to prepare for the inevitable trend towards ultrasensitive
components (Class 0, 00, 000) and about the wide
spread lack of understanding regarding CDM (Charged
Device Model). It is no longer business as usual and it can
take up to two years to prepare.
Advanced auditing techniques and measurements will be
discussed as well as innovative control methods for
manufacturing. A case study will be presented which
illustrates cost effective improvement that resulted in yield
improvements as high as 22%.
This Webinar forum enables two-way discussions with the
presenters as well as group interaction. Don't miss out on
this exciting educational opportunity and come prepared with questions. |
|
Nov 10, 2009 • 2:00 p.m. Eastern Time • Course length - one hour
Presenter: Terry Welsher, Danglemayer Associates, LLC
Location: Online
Developed by: Leo G. Henry, Ph.D. ESD & TLP Consultants, LLC and Terry Welsher, Danglemayer Associates, LLC
More Info: Go to ESD Association
Fees for Online Courses:
Members - $95.00 Per Course
Non-Members - $140.00 Per Course
|
Charged Board Events: A Growing Industry Concern
It has long been known that ICs and other ESD–sensitive components remain at risk when they are mounted onto printed–circuit boards and other assemblies. However, most ESD testing and characterization of these components has been done on stand–alone parts. Further, IC failure analysis data, which is based on knowledge of failure signatures seen in standard HBM and CDM tests, has caused many to conclude that ESD failures are relatively rare when compared to other electrical failures commonly classified as electrical overstress (EOS). Recent data and experience reported by several companies and laboratories now suggest that many failures previously classified as EOS may instead be the result of ESD failures due to Charged Board Events (CBE). A charged board stores much more energy than a device (IC) because its capacitance is many times larger. In fact, the charge (energy) transferred in the event is so large that it can cause EOS–like failures to the components on the board. In this seminar, this board–level ESD event will be compared with the component level CDM ESD event. The waveforms from both ESD events will be compared and it will be shown that for the same voltage, the current in the board–level ESD event will be much higher than that from the chip–level ESD event. A summary of literature and industry data will be given. It is suggested that failure analysts give stronger consideration to these types of board level events before assigning an EOS diagnosis to the failure. This will support more effective root cause analysis and prevention of these failures. |
|
October 14, 2009
IEEE Boston Reliability Chapter monthly meeting
Location:RSA, the Security Division of EMC Corp., Bedford MA
Speaker:Ted Dangelmayer, Dangelmayer Associates, L.L.C
More Info: Go to PDF Flyer |
IEEE Boston Reliability chapter October Joint meeting with ESDA Northeast
Common ESD Myths and Pitfalls of ESD Measurement Instruments
Agenda:
5:30-6:00 Sign In, personal networking, food & refreshments
6:00-6:10 Welcoming remarks, chapter announcements, presenter introduction
6:10-7:30 Featured guest presenter- Ted Dangelmayer
7:30-8:00 Q&A session, meeting adjourns |
|
July 22 & 23, 2009
Annual North American Workshop
Location: Gloucester, MA
Facility Information: http://www.rsa.com/node.aspx?id=1059#Bedford
Time: 5:30PM
Speaker: G. Theodore Dangelmayer
More Info: Go to PDF Flyer |
Annual North American Workshop
|
|
June 4, 2009 . 2:00 p.m. Eastern Time . Course length - one hour
Location: On-Line Training
Presenter:
Leo G. Henry, Ph.D. ESD&TLP Consultants, LLC
Developed by::
Leo G. Henry, Ph.D. ESD&TLP Consultants, LLC and
Terry Welsher, Danglemayer Associates, LLC
Offered by the ESD Association
More Info: Go to the PDF Flyer
|
Charged Board Events: A Growing Industry Concern
It has long been known that ICs and other ESD-sensitive components remain at risk when they are mounted onto printed-circuit boards and other assemblies. However, most ESD testing and characterization of these components has been done on stand-alone parts. Further, IC failure analysis data, which is based on knowledge of failure signatures seen in standard HBM and CDM tests, has caused many to conclude that ESD failures are relatively rare when compared to other electrical failures commonly classified as electrical overstress (EOS). Recent data and experience reported by several companies and laboratories now suggest that many failures previously classified as EOS may instead be the result of ESD failures due to Charged Board Events (CBE). A charged board stores much more energy than a device (IC) because its capacitance is many times larger. In fact, the charge (energy) transferred in the event is so large that it can cause EOS-like failures to the components on the board. In this seminar, this board-level ESD event will be compared with the component level CDM ESD event. The waveforms from both ESD events will be compared and it will be shown that for the same voltage, the current in the board-level ESD event will be much higher than that from the chip-level ESD event. A summary of literature and industry data will be given. It is suggested that failure analysts give stronger consideration to these types of board level events before assigning an EOS diagnosis to the failure. This will support more effective root cause analysis and prevention of these failures. |
|
March 18, 2009 . 2:00 p.m. Eastern Time
Class 0 & CDM Trends and Counter Measures
Location:On-Line Training
Instructor: G. Theodore Dangelmayer
Offered by the ESD Association
More Info: Go to the PDF Flyer
|
Class 0 & CDM Trends and Counter Measures
Learn how to prepare for the trend towards extensive use of ultra-sensitive components (Class 0) and the wide spread lack of understanding about CDM (Charged Device Model). It is no longer business as usual and it can take up to two years (example-equipment retooling etc) to prepare. Join us for this presentation and learn why this is inevitable and how to prepare for it.
Get the answers to your questions as well as these examples. Are you skeptical about this news of a Class 0 trend? Is it really happening? Is it likely to be a problem in your factory? How big a problem is CDM in manufacturing? What is different about CDM controls? How do I tailor S20.20 for CDM and Class 0?
Instructor: Ted Dangelmayer, Dangelmayer Associates, L.L.C. |
2008
|
|
July 23 & 24, 2008
Annual North American Workshop
Location: Gloucester, MA
Speaker: G. Theodore Dangelmayer
More Info: Go to PDF Flyer |
Annual North American Workshop
CDM & Class 0 & S20.20 Highly Interactive ESD Workshop
Hands-on ESD Workshop with the Dream Team:
CDM & Class 0 & S20.20, Issue 2
Learn How to Prepare for the "Perfect ESD Storm" that
is brewing in the Electronics Industry!
The Industry trend towards extensive use of ultra-sensitive
components (Class 0) and the wide spread lack of CDM
understanding are brewing the "Perfect ESD Storm"!
Join the "ESD Dream Team" in this highly interactive
workshop and learn why this is inevitable and how to
prepare for it. You will also learn what is new with
S20.20, Issue 2 - strengths and technical gaps.
Intended For Professionals Who:
- Have Achieved Basic Knowledge Of ESD
- Understand Its Potential For Damage
- Desire Roadmap For Current And Future Protection
- Need A Better Understanding of CDM and S20.20
- What You Will Learn:
- CDM (Charged Device Model) & Class 0 Basics
- Why Industry Trend Toward Class 0 Is Inevitable
- Over 95% of ESD Failures are CDM
- Confirmed by Failure Mode Analysis
- How To Prepare For the ESD "Perfect ESD Storm"
- Hands-On CDM & Class 0 Test Methods
- What's New with ESDA S20.20, Issue 2 -2007
- Strengths and Technical Gaps
- How To Tailor the Technical Gaps
- How to Develop and Implement Sound ESD
Programs
|
|
May 6-8, 2008
ESDA Tutorials
Location: Tyngsboro, MA
Speaker: G. Theodore Dangelmayer
|
ESD Basics for the Program Manager
May 6, 2008, 8:30 a.m. - 4:30 p.m.
Instructors: Ted Dangelmayer, Terry Welsher, Dangelmayer Associates, L.L.C.
This tutorial consists of three sections. Section A defines the causes of ESD and critical elements related to charge generation, material characteristics and electrostatic phenomenon. Section B explains and demonstrates the four critical device failure models. Section C provides an overview of device protection during handling and product assembly, a summary of ESD control elements, and a fundamental overview of S20.20 program requirements. This full day course is required for those in-plant auditors and program managers who are working toward professional ESD certification. Contact ESDA.org
|
|
April 17, 2008
Surface Mount Technology Association Expo
Location: Atlanta, GA
Speaker: Dangelmayer Associates
|
ESD Controls and Class 0 Parts
Dangelmayer Associates will present "ESD Controls and Class 0 Parts"
|
|
March 19, 2008
Northeast Chapter of ESDA Program/ ESD Test Equipment Workshop: Part 2
Uses and Pitfalls of ESD Measurements
Location: Lowell, MA
Speakers: Ted Dangelmayer, Dangelmayer Associates, L.L.C. and Vaughn Gross, Green Mountain Labs
More Info:Contact Vicki@dangelmayer.com
|
Northeast Chapter of ESDA Program/ ESD Test Equipment Workshop: Part 1
Uses and Pitfalls of ESD Measurements
|
|
Feb. 13, 2008
Northeast Chapter of ESDA Program/ ESD Test Equipment Workshop: Part 1
Uses and Pitfalls of ESD Measurements
Location: Lowell, MA
Speakers: Ted Dangelmayer, Dangelmayer Associates, L.L.C. and Vaughn Gross, Green Mountain Labs
More Info:Contact Vicki@dangelmayer.com
|
Northeast Chapter of ESDA Program/ ESD Test Equipment Workshop: Part 1
Uses and Pitfalls of ESD Measurements
|
|
February 4-6, 2008
Defense Manufacturing Summit
Location: Las Vagas, NV
Speaker: G. Theodore Dangelmayer
|
Defense Manufacturing Summit
Ted Dangelmayer will present "The Perfect ESD Storm" as a guest speaker at the Defense Manufacturing Summit.
|
2007
|
|
Wednesday, September 19, 2007, 4:00 - 4:30 PM - NEW! BOOK SIGNING EVENT TO BE HELD AT THE 2007 EOS/ESD SYMPOSIUM!
Location: Disneyland Hotel in Anaheim, CA
Author: G. Theodore Dangelmayer
Book: ESD Program Management, 2nd Edition
- This revision is comprehensive and explains how to develop, implement and manage an ESD control program, and includes up-to-date data, many new chapters, new case studies, and much more.
For further information, please visit the linked ESDA THRESHOLD™. |
The ESD Association is proud to announce its first Book Signing, to take place during the 29th Annual EOS/ESD Symposium, September 16 - 21, 2007, at the Disneyland Hotel in Anaheim, CA.
Leading authors and educators in today's ESD Industry will be signing their books at the ESD Association Sales Booth, located in the Disneyland Hotel, EOS/ESD Symposium Registration Area.
Check out the schedule below and be sure to take advantage of this opportunity to meet authors in person, ask questions, and have your books signed!
We look forward to seeing you there!
|
|
September 16-21, 2007 - Tutorial: “The Perfect ESD Storm” - EOS/ESD Symposium.
Location: Disneyland Hotel in Anaheim, CA
Speakers: Ted Dangelmayer
For further information, please visit the linked ESDA THRESHOLD™. |
Hands-on ESD Workshop with Ted Dangelmayer, North America CDM/ Class 0 workshop. Interactive, individualized, and highly informative, expert and all-inclusive training will prepare you for Phase 2 of the ESD storm ahead.
|
|
November 15th, 2007 - “The Perfect ESD Storm”
Event: The 40th International Symposium on Microelectronics
Location: McEnery Convention Center - San Jose, California USA
Session: THA4-A Electrostatic Discharge Protection
Time: 8:50 AM - 12:00 PM
Speakers: Ted Dangelmayer
For further information, please visit the linked The 40th International Symposium on Microelectronics. |
Presention: technical paper "The Perfect ESD Storm", Electrostatic Discharge Protection. |
|
September 16-21, 2007 - EOS/ESD Symposium. The 2007 EOS/ESD Symposium will work its magic in Anaheim, California. The Disneyland Hotel will host the 29th annual event.
Location: Anaheim, California
Speakers: T.B.A.
For further information, please visit the linked ESDA THRESHOLD™. |
Recognized as the international forum for furthering the understanding of electric overstress and electrostatic discharge, the annual EOS/ESD Symposium attracts attendees and participants from throughout the world.
Focusing on technology and solutions, the EOS/ESD Symposium covers a broad base of interests including industrial, computer, communications, and military electronics; web processing; cleanrooms; semiconductors, MR/Storage devices; and electronic systems, components, and equipment. |
|
July 25-26, 2007 - CDM + Class 0 = "The Perfect ESD Storm" Workshop
Location: Cape Ann, Gloucester, MA
Speakers: The Dream Team - Dangelmayer Associates L.L.C.
If you have questions, please contact Vicki Dangelmayer. |
Hands-on ESD Workshop with the Dream Team:
North America CDM/ Class 0 workshop. Interactive, individualized, and highly informative, the "Dream Team" expert and all-inclusive training will prepare you for Phase 2 of the ESD storm ahead. |
|
May 22nd, 23rd and 24th, 2007 - NE Chapter is holding an Regional Tutorial Program jointly with the ESDA
Location: Tyngsboro, MA
Speakers: Steve Voldman, Warren Anderson, Steve Halperin and Mike Hopkins
If you have questions, please contact Vicki Dangelmayer. |
Further Information can be found on Page 2 of this linked PDF document
RF On-Chip ESD Protection Design and Test - May 22
Troubleshooting On-Chip ESD Failures - May 22
ESD Basics for the Program Manager - May 23
Packaging Principles for the Program Manager - May 24
System Level ESD/EMI:Testing to IEC and Other Standards - May 24
|
|
April 4th, 5th and 6th, 2007 - Workshop
Location: Korea
Speakers: Ted Dangelmayer - Dangelmayer Associates L.L.C.
If you have questions, please contact Vicki Dangelmayer. |
Learn how to prepare for the "Perfect ESD Storm" that is brewing in the electronics industry! The trend towards extensive use of ultra-sensitive components (Class 0) and the wide spread lack of CDM (Charged Device Model) understanding are brewing the "Perfect ESD Storm"! It is no longer business as usual and it can take up to two years to prepare. Join us for this highly interactive tutorial and learn why this is inevitable and how to prepare for it. |
|
March 25th - 29th, 2007 - Electrostatics 2007 Conference
Location: St Catherine's College, Oxford, UK
For further information, please visit linked Announcement for contact info at the bottom of this Call for Papers. |
This conference is organised by the Electrostatics Group of the Institute of Physics and continues the International Conference series on Electrostatics which takes place in the United Kingdom every four years. |
|
March 21, 2007 (backup date: March 14)
Location: Zoll Medical Factory
|
NE Chapter of the ESD Association Event - Zoll Medical Factory Tour |
|
March 5, 2007 - WORKSHOP: Electrostatic Issues in Semiconductor Manufacturing
1:30pm - 5:30pm (1330 - 1730)
Location: Boston Marriott Quincy, Quincy, MA
Speakers: Lou DeChiaro and Terry Welsher - Dangelmayer Associates |
Impact of Technology Evolution on Wafer Level ESD Damage
For More information, please visit the below SEMI link: Semiconductor Equipment and Materials International
|
|
March 5, 2007 - WORKSHOP: Electrostatic Issues in Semiconductor Manufacturing
1:30pm - 5:30pm (1330 - 1730)
Location: Boston Marriott Quincy, Quincy, MA
Speakers: Ted Dangelmayer - Dangelmayer Associates |
Perfect ESD Storm - CDM and Class 0 Converge in Backend Processes
For More information, please visit the below SEMI link: Semiconductor Equipment and Materials International
|
|
February 20, 2007, Tues, 4:00pm - Seminar on "ESD Auditing -2007", for the The Silicon Valley EOS/ESD Society's BOARD MEETING
Location: SIVA-ESD, Ramada Inn, 1217 Wildwood Ave, Sunnyvale, CA 94089
Speakers: Larry Fromm
For further information, please visit The Silicon Valley EOS/ESD Society's website. |
ESD Auditing -2007 |
|
January 31, 2007 - NE Chapter Meeting
Location: Thermal, Lowell, MA
Speakers: Vaughn Gross & Ted Dangelmayer
For further information, please visit The NE Chapter of the ESD Association. |
Basic ESD test instruments and how to use them. Event detector and static locator |